Nearfield Instruments Semiconductor Metrology Solutions Partner with imec

Nearfield Instruments semiconductor metrology solutions team up with imec to advance 3D, non-destructive, in-line process control for next-gen chips

Nearfield Instruments semiconductor metrology solutions are set to take a major leap forward as the company announces a strategic development project in collaboration with imec. This multi-year initiative aims to accelerate innovation in semiconductor process control, combining cutting-edge research with proven technology to address complex manufacturing challenges.

QUADRA Deployment at imec’s Leuven Facility

As part of the collaboration, Nearfield Instruments semiconductor metrology solutions will be deployed through its flagship QUADRA system at imec’s advanced R&D facility in Leuven. Together, the organizations will develop next-generation tools for High-NA EUV lithography, 3D logic device profiling, and heterogeneous integration, providing the industry with highly precise, non-destructive, and in-line process control capabilities.

Advancing High-NA EUV Lithography Metrology

High-NA EUV lithography metrology is a central focus of this project. Engineers will leverage Nearfield Instruments semiconductor metrology solutions to perform 3D resist characterization using the proprietary High-Aspect-Ratio imaging mode (FFTP). This approach is designed to improve scanner productivity while delivering unparalleled insight into advanced lithography processes.

3D Profiling of Advanced Logic Devices

The collaboration will also focus on 3D profiling of high-aspect-ratio structures such as CFETs. QUADRA’s side-wall imaging mode, part of Nearfield Instruments semiconductor metrology solutions, enables precise characterization of these complex architectures. Accurate 3D process control ensures optimal device performance, yield, and reliability as vertical stacking and miniaturization continue to advance.

Enhancing 3D Heterogeneous Integration

Finally, the project will target metrology for 3D heterogeneous integration, including hybrid bonding and full-die inspection. Using ULSA technology, Nearfield Instruments semiconductor metrology solutions will enhance measurement of copper pad and dielectric roughness, erosion, dishing, edge roll-off, and other critical parameters, combining high throughput with nanometer-level resolution.

“Partnering with imec allows us to push the boundaries of what is possible in semiconductor manufacturing process control,” said Dr. Hamed Sadeghian, CEO of Nearfield Instruments. “Nearfield Instruments semiconductor metrology solutions are built to meet the demands of next-generation devices, including AI chips and advanced logic technologies.”

This collaboration marks a critical step in bridging innovative metrology with advanced semiconductor process development, ensuring the continued evolution of chip manufacturing for the digital era.